Wafer inspection microscopes cannot be configured by “multiple” only. The 8 ”wafer diameter is about 200 mm, the 12” wafer diameter is about 300 mm, and the sample size, defect type, viewing method, stage travel, and software functions all affect the entire package. Looking only at the host magnification, it is easy to have problems such as the sample cannot be placed, the edge cannot be seen, the working distance is insufficient, or the measurement results cannot be reproduced.
Common inspection solutions for 8-inch wafers can consist of a large platform metallographic microscope, a long working distance objective, and an 8-inch wafer table. With a diameter of about 300 mm, 12-inch wafers have higher requirements for stage travel, load-bearing stability, mobile repeatability, and scratch resistance, and usually require a larger dedicated stage or motorized stage solution.
If the travel of the existing equipment platform is insufficient, it cannot be solved by replacing a higher magnification objective lens. Priority must be given to wafer placement, XY travel, rotational capacity, edge accessibility, and fixture height.
Conventional surface defects can be selected for the upright or large platform metallographic structure; the inverted structure can be evaluated when special containers need to be viewed or placed from below. The mainframe should have a stable focusing mechanism, sufficient bearing space and an expandable optical path.
It is recommended to configure common magnifications such as 5X, 10x, 20x, and 50x according to the detection target, and confirm the working distance, numerical aperture, and field of view. Large-area preliminary inspection and high-power detail observation often require different objectives, and a single high-power objective cannot be used to complete all the work.
The bright field is used for conventional surface and graphic observation, the dark field is suitable for scratches, particles and low contrast defects, polarized light can be used for partial film layer and stress observation, and DIC can enhance microscopic fluctuations and surface structure. The need for these features should be determined by the actual defect type.
Wafer requires a stage with large travel and low scratch risk. The manual table is suitable for use scenarios based on fixed-point observation; the motorized table is suitable for batch scanning, coordinate recording and automatic splicing. The wafer clamp and adsorption method must match the sample size.
The camera focuses on resolution, target size, frame rate, interface, and software compatibility. Lighting should be uniform, avoiding local over-lighting to conceal defects. When it is necessary to record the inspection process, it is also necessary to confirm the ability of image preservation, video recording and coordinate marking.
The software shall support calibration, dimensioning, defect marking, lot recording and report export. If automatic stitching is required, confirm the field of view overlap, stitching speed, data volume, and breakpoint recovery method.
JM580BD research-grade wafer detection microscope, suitable for large platforms and light and dark field observation schemes
JM540BD Bright and Dark Field Metallographic Microscope for Wafer, PCB Slicing and Material Inspection
Ordinary metallographic microscopes often have insufficient stages and strokes. It is difficult to cover the entire wafer and edge area even if you can see the part, and large travel or electric wafer table should be configured.
Not necessarily. Bright fields are suitable for regular surfaces and graphics, and dark fields are more helpful for particles, scratches, and low-contrast defects. The need for a dark field depends on the defect type and acceptance criteria.
Short-wave infrared is suitable for non-destructive observation of the interior and packaging structure of silicon materials, but does not cover all materials and defect types. Whether or not to use should be judged in conjunction with the sample, defect location and test criteria.
JM-SWIR series of short-wave infrared microscopes, which can be used to observe the interior and packaging structure of silicon materials
Please provide the wafer size, sample photo, main defect type, detection magnification and whether automatic splicing is required. Instrument Card Ink Optics can configure the host, objective, stage, camera, light source and software according to the actual sample.
Submit wafer size and detection targets for configuration checklist
Tell us the material, the feature you need to see and the magnification range. We will recommend a configuration and quote it.
